Electronic materials and processes handbook / Charles A. Harper, editor in Chief.
Material type:
TextPublication details: New York : McGraw-Hill, c2004Description: 1 v (various pagings) ill. 24 cmISBN: - 0-07-140214-4
- R TA 7836 .El25 2004
| Item type | Current library | Call number | Status | Date due | Barcode | |
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Reference
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Aklatang Emilio Aguinaldo-Information Resource Center Reference | TA 7836 .El25 2004 (Browse shelf(Opens below)) | Not for loan | 3AEA0000287728 |
Chap. 1 Developemnt and Fabrication of IC Chips , Chap.2 Plastics , Elastomers, and Composites , Chap.3 Ceramics ,Chap.4 Metals , Chap. 5 Solder Technologies for Electronic Packaging and assembly , Chap.6 Electroplasting and Deposited Metallic Costings ,Chap.7 Printed Circuit Board Fabrication , Chap.8 Materials and Processes for Hybrid Microelectronics and Multichip Modules , Chap.9 Adhesives,Underfills,and Coatings in Electronics Assemblies , Chap.10thermal Management Materials and Systems .
and adhesives, underfills, and coatings for electronic assemblies. Includes a chapter that covers all aspects of thermal management materials and systems.
circuit boards and processing
hybrid microelectronic materials and processes
The first group of chapters discuss the basic material categories of importance in electronics, including semiconductors, plastics, elastomers, composites, ceramics, glasses and the various classes of metals. The next group of chapters describe processes and materials used to interconnect electronic parts and assemblies. These include electroplated and deposited metallic coatings
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