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Electronic packaging : design, materials, process, and reliability / John H. Lau. by
Material type: Text Text; Format: print ; Literary form: Not fiction
Publication details: New York : McGraw-Hill, c1998
Availability: Items available for loan: Aklatang Emilio Aguinaldo-Information Resource Center (1)Call number: TK 7870.15 .El25 1998.

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Chip scale package (CSP) : design, materials, processes, reliability, and applications. / John H. Lau. by
Material type: Text Text; Format: print ; Literary form: Not fiction
Singapore : McGraw-Hill, [1999];copyright 1999
Availability: Items available for loan: Aklatang Emilio Aguinaldo-Information Resource Center (1)Call number: TK 7874 .L36 1999.

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